Research on Intelligent Manufacturing and Assembly (RIMA) (ISSN: pending) is an open access, continuously published, international, refereed journal publishing original peer-reviewed scholarly articles that are of general significance to technologies developed and studied for design, analysis, manufacturing and operation of Intelligent Manufacturing and Intelligent Equipment to provide a vital link between the research community and practitioners in industry.

Topics of interest include, but are not limited to the following:
• Digital design and manufacturing
• Theory, method and system of intelligent design
• Intelligent processing
• Intelligent monitoring and control
• Modelling, operation, control, optimization and scheduling of manufacturing system
• Manufacturing system simulation and digital twin
• Industrial control and industrial internet of things
• Safety critical equipment and reliability assessment
• Intelligent equipment
• Intelligent robot

Vol 1 No 1 (2022)

Published: 2022-02-24

Abstract views: 188   PDF downloads: 112  

Pages 1-2

From the Editor-in-Chief of RIMA

blankpage Matthew Chin Heng Chua

The journal RIMA would be the bridge between researchers and industry practitioners. The key theme on smart factories encompasses many topics of interests; for example, digital design, novel control algorithms, digital twins, cobots (collaborative robots) and more. Furthermore, in today’s pandemic world which has significantly transformed the way traditional manufacturing industries operate, there is an even greater drive for a change in the manufacturing paradigm. Scientists and engineers of today should take bold steps in proposing and validating new workspace architecture that is reflective of the future. For instance, the development of digital twins or even virtual collaborative manufacturing are key drivers as we move into a future where both the virtual world and reality become seamless.

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Matthew_Chin_Heng_Chua-photo  ISSN: pending
 Abbreviation: Res Intell Manuf Assem
 Editor-in-Chief: Dr. Matthew Chin Heng Chua (Singapore)
 Publishing Frequency: Continuous publication
 Article Processing Charges (APC): 0

 Publishing Model:
Open Access